| Model ID | NPM-D3 |
| Rear head | Lightweight | 12-nozzle head | 8-nozzle head | 2-nozzle head |
| Front head | 16-nozzle head |
| Lightweight 16-nozzle head | NM-EJM6D |
| 12-nozzle head |
| 8-nozzle head |
| 2-nozzle head |
| PCB dimensions*1 (mm) | Dual-lane mode | L 50 x W 50 ~ L 510 x W 300 |
| Single-lane mode | L 50 x W 50 ~ L 510 x W 590 |
| PCB exchange time | Dual-lane mode | 0 s* *No 0s when cycle time is 3.6 s or less |
| Single-lane mode | 3.6 s* *When selecting short conveyors |
| Electric source | 3-phase AC 200, 220, 380, 400, 420, 480 V 2.7 kVA |
| Pneumatic source*2 | 0.5 MPa, 100 L /min (A.N.R.) |
| Dimensions*2(mm) | W 832 x D 2652*3x H 1444*4 |
| Mass | 1680 kg (Only for main body: This differs depending on the option configuration.) |
| Placement head | Lightweight 16-nozzle head (Per head) | 12-nozzle head (Per head) | 8-nozzle head
(Per head) | 2-nozzle head (Per head) |
| High production mode [ON] | High production mode [OFF] |
| Max. speed | 42 000 cph
(0.086 s/ chip) | 38 000 cph
(0.095 s/ chip) | 34 500 cph
(0.104 s/ chip) | 21 500 cph
(0.167 s/ chip) | 5500 cph (0.655 s/ chip)
4250 cph (0.847 s/ QFP) |
| Placement accuracy (Cpk≧1) | +/- 40 um/chip | +/- 30 um / chip
(+/- 25 um / chip*5) | +/- 30 um / chip | +/- 30 um/chip,
+/- 30 um/QFP
£12mm to £32mm
+/- 50 um/QFP
£ 12mm Under | +/- 30 um/QFP |
| Component dimensions (mm) | 0402 chip*6 to L6 x W6 x T3 | 03015*6*7/ 0402 chip*6 to L6 x W6 x T3 | 0402 chip*6 to L12 x W12 x T6.5 | 0402 chip*6 to L 32 x W 32 x T 12 | 0603 chip to L 100 x W 90 x T 28 |
| Component supply | Taping | Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm | Tape : 4 to 56 / 72 / 88 / 104 mm |
| Max. 68 (4, 8 mm tape, Small reel) |
| Stick | – | Max.16 (Single stick feeder) |
| Tray | – | Max.20 (per tray feeder) |
| Adhesive position accuracy(Cpk ≧ 1) | +/- 75 umm /dot | +/- 100 umm /component |
| Applicable components | 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP | SOP,PLCC,QFP, Connector, BGA, CSP |
| Inspection head | 2D inspection head (A) | 2D inspection head (B) |
| Resolution | 18 um | 9 um |
| View size (mm) | 44.4 x 37.2 | 21.1 x 17.6 |
| Inspection processing time | Solder Inspection*9 | 0.35s/ View size |
| Component Inspection*9 | 0.5s/ View size |
| Inspection object | Solder Inspection*9 | Chip component : 100 um x 150 um or more (0603 mm or more);
Package component : φ150 um or more | Chip component : 80 um x 120 um or more (0402 mm or more);
Package component : φ120 um or more |
| Component Inspection*9 | Square chip (0603 mm or more), SOP, QFP (a pitch of 0.4 mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10 | Square chip (0402 mm or more), SOP, QFP (a pitch of 0.3 mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10 |
| Inspection items | Solder Inspection*9 | Oozing, blur, misalignment, abnormal shape, bridging |
| Component Inspection*9 | Missing, shift, flipping, polarity, foreign object inspection*11 |
Inspection position accuracy*12
(Cpk ≧ 1) | +/- 20 um | +/- 10 um |
| No. of inspection | Solder Inspection*9 | Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine) |
| Component Inspection*9 | Max. 10 000 pcs./machine |
