| MPM MOMENTUM+ Automatic Solder Paste Stencil Printer Eonfiguration: |
| Stencil size: 29 x 29, |
| Maximum Board Size: (X x Y) 609.6 mm x 508 mm (24” x 20”), |
| Minimum Board Size: (X x Y) 50.8 mm x 50.8 mm (2” x 2”), |
| Board Thickness: 0.2 mm (0.008″) to 5.0mm (0.20”) , |
| Maximum Board Weight: 4.5 kg (9.92 lbs), |
| Board Edge Clearance: 3.0 mm (0.118″), |
| Fixed top clamps, centernest vacuum option, |
| Underside Clearance: 12.7 mm (0.5″) standard, |
| 2D inspection, |
| Board Hold-Down, |
| Closed Loop Stencil Wiper with Vacuum and Solvent Automatic Stencil Positioning, |
| Board Stop Sensor and Cylinder, |
| Windows XP based Benchmark GUI software, |
| SPC data collection, |
| Standard SMEMA, |
| 200V / 240V single phase power. |
MPM Momentum+ (Plus) is a speed-enhanced version of the popular MPM Momentum printer. It’s designed for customers who want a shorter cycle time, but don’t want to invest in hardware upgrades and enhancements to increase performance to a level that isn’t needed.
MPM’s patented printer-based Vision and Inspection system is a cost-effective way to verify print and paste deposit results. It’s flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D Inspection is integrated directly into the stencil printer to provide an immediate source of data.
