| Model | I-PLUSE S10 |
| Substrate Size | (When buffer function
is not used) | Min. L50xW30mm~Max. L1,330xW510mm (Standard L955) |
(When the inlet or outlet
buffer function is used) | Min. L50 xW30mm~Max. L420xW510mm |
(When the inlet and outlet
buffer functions are used) | Min. L50xW30mm~Max. L330xW510mm |
| Substrate Thickness | 0.4~4.8mm |
| Substrate Transport Direction | Left → Right (standard) |
| Substrate Transfer Speed | Max 900mm/sec |
Mounting Speed
(12-Axis Mounting Head +2θ)
Optimal Conditions | 0.08sec/CHIP (45,000CPH) |
Mounting Accuracy
AA(μ+3σ) | CHIP ±0.040mm |
Mounting Accuracy
B A(μ+3σ) | IC ±0.025mm |
| Mounting Angle | ±180° |
Z-Axis Control/θ-Axis
Control | AC Servo Motor |
| Component Height | Max 30mm*1 (Maximum height of first mounted component within 25mm) |
| Component Mountable | 0201 ~120x90mm BGA, CSP, Connectors, Other Shaped Components (Standard 0402~) |
| Component Supply Pattern | 8 ~ 56mm Belt (F1/F2 Feeder), 8 ~ 88mm Belt (F3 Motorized Feeder), Pole Feeder, Tray |
Determination Of
Components Being Brought Back | Negative Pressure Examination and Image Examination |
| Multi-Language Screen Support | Japanese, Chinese, Korean, English |
| Substrate Positioning | Clip-in substrate fixing unit, front side reference, automatic transfer width adjustment |
Number Of Feeders
That Can Be Installed | Maximum 90 types (converted to 8mm tape) 45 lines x 2 |
| Substrate Transfer Height | 900±20mm |
Dimensions And Weight
Of Main Unit | L1,250xD1,750 xH1,420mm、approx. 1,200 kg |
